Description
| Technical Specifications | ||
|---|---|---|
| Product | GOEPBE200 | |
| Product Revision | rev 1.1 | |
| Bus Type | PCI Express rev 3.0 | |
| Bus Width | x1 Lane PCI Express (8.0GT/s), operable in x1, x4, x8, x16 slots | |
| Interfaces | PCIe x1, 9-pins USB 2.0 M/B header (for Bluetooth only) | |
| Wireless Frequencies | 2.4GHz: 574Mbps / 5GHz: 2400Mbps / 6GHz: 5800Mbps, BT 5.4: 2402MHz~2483MHz | |
| Total Bandwidth Capacity | 8774Mbps | |
| Chipset | Intel® BE200 | |
| Antenna Gain | 2T2R RP-SMA 6dBi External Antenna (with magnetic base, 1.5m cable length) | |
| Power Requirements | 10W | |
| Dimensions | 77 x 68 x 22 mm (without antennas) | |
| Weight | 0.045 kg | |
| Compatibility | ||
| Operating System Support |
Please note that the BE200 module is only supported by 10th Gen or later Intel-based platforms (Intel CPU with CNVio2 support). |
|
| IEEE Support | 802.11 a/b/g/n/ac/ax/be | |
| Additional Features |
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| Additional Information | ||
| Regulatory Compliance | FCC Part 15 Class B, CE, RoHS | |
| Operating Environment | Temperature: 0 ℃ to 55 ℃ Relative Humidity: 10%-90% (non-condensing) |
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| Storage Environment | Temperature: -10℃ to 70℃ Relative Humidity: 10%-90% (non-condensing) |
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| MTBF | >50,000h @ 25°C | |
| Packaging | ||
| Contents |
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| Dimensions | 225 x 145 x 35 mm | |
| Weight | 0.18 kg | |
